Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN), a globally active technology group for innovative systems and processes in the photovoltaic industry, launches the market introduction of a new product, the BrickMaster BM850, for bricking mullti-crystalline silicon ingots in the solar market. The new high-tech wire saw is based on the wire saw technology developed specifically by Meyer Burger for the photovoltaic industry and allows for the precise and quick bricking of multi-crystalline silicon ingots into high-grade square bricks. The BrickMaster increases machine utilisation by up to 65% due to the modular design of the machine, an independent, parallel wire tension system and a sophisticated maintenance process.
Customers benefit from cost reductions for maximum production yield
The need on the part of the customer to slice valuable multi-crystalline silicon ingots as quickly and accurately as possible and at the lowest cost of ownership for further processing in the manufacturing process for thin and high-grade silicon wafers were the key issues when developing the BrickMaster. After a development period of only six months Meyer Burger can now present to its customers a wire saw that fully meets these requirements.
Modular design – maximum machine utilisation
The entire machine is based on a modular design of established and effective wire saw technologies used in the DS264 and DS271 models. The wire web for slicing the multi-crystalline silicon ingot is guided over four pulleys and controlled accordingly by independent drive motors. This ensures uniform tension of the wire web and the risk of a wire break is minimised.
The markedly improved machine utilisation means an increase in production yield of 10%, a fact that can lead to distinctly lower cost of ownership throughout the entire value-added chain of wafer manufacturing. The BrickMaster also sets new standards in terms of consumables. Compared to other systems of this type available in the market, the cost for consumables and spare parts such as wire guide rollers and pulleys could be reduced by more than 30 percent. As a result, the BrickMaster offers a cost advantage of 5 – 7% in terms of consumables for each silicon brick cut and about 8% in terms of manufacturing costs for each silicon brick.
Another outstanding feature of the product is the cutting unit that can be operated entirely separate from and parallel to the production process. While one bricking process is running, at the same time a second cutting unit can be fitted with a wire web or maintenance work carried out on the cutting unit. The cutting unit can be entirely removed, thus increasing the machine utilisation by more than 65 percent. This operating process is unique in the industry and underlines Meyer Burger Technology Group’s leading position in the photovoltaic industry.
Current market situation doesn’t permit return to normality
On 24th February 2009 the Meyer Burger Ltd group company, with its production facility in Thun, announced a temporary introduction of short-time working from 2nd March until 31st May 2009. Employees from the production department have been affected by the short-time working procedure. The first signs of an economic stabilisation and the strong solar development plan for China announced recently by the Chinese government did not have any positive influence on the delivery situation among Asian customers in the short and medium term. Therefore, Meyer Burger Ltd shall extend short-time working throughout the summer months. The research & development, machine and software development, services, marketing, sales and finance divisions shall continue to be exempt from short-time working.
For further information, please contact:
Werner Buchholz, Head of Group Communications
+41 33 439 05 06 - w.buchholz@meyerburger.ch
About Meyer Burger Technology Ltd
www.meyerburger.ch
Meyer Burger Technology Ltd is a leading and globally active technology group for innovative systems and processes for cutting and handling crystalline and other high-grade materials.
The machines, competences and technologies of the different companies in the group are used in the solar industry (photovoltaics), semi-conductor and optical industry. The thinnest wafers made from silicon, sapphire or other crystals are required in these three markets to manufacture solar modules, switching circuits or high-performance LEDs. The group’s core competences are made up of a whole range of production processes, machines and systems that are used within the value chain in the manufacture of high quality wafers. The comprehensive range of products is complemented by a worldwide service network with wear and tear parts, consumables, re-grooving service, process know-how, servicing, after-sales service, training and other services. As a globally active company, the group is represented in Europe, Asia and North America in the respective key markets.
Meyer Burger has its headquarters and the production facility of Meyer Burger Ltd in Switzerland, while the group companies, Meyer Burger Automation GmbH, Hennecke Systems GmbH and and AMB Apparate + Maschinenbau GmbH, have their headquarters and production facilities in Germany. The group also has subsidiaries and own service centres in Germany, Norway, China and Japan, which all are represented by its own staff on-site. In Taiwan and the USA, Meyer Burger works with independent sales and service partners that are part of Meyer Burger’s global service network. In other important countries the company relies on selected independent agents. Meyer Burger generated net sales of CHF 455 million in fiscal year 2008 and employed more than 630 staff worldwide as of year end 2008.
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