Meyer Burger Technology Ltd (SWX Swiss Exchange: MBTN) announced today that the company concluded the biggest contract for the supply of band and wire saws in Meyer Burger’s history with REC ScanWafer AS, a major manufacturer of multicrystalline silicon wafers for the solar industry. The volume of this order is unique for Meyer Burger and the solar industry because of its size, the quality standards demanded, the automation of production and the process control.
In addition to supplying wire and band saws, Meyer Burger shall also be setting up a dedicated service office close to the customer’s production plants to provide quality assurance of the servicing and process sequences using its own employees. “We have carried out intensive slicing experiments with the client at our plant in Steffisburg and met the requirements for manufacturing 120 μm wafers for the lowest kerf loss and material consumption with our wire saws“, Peter Pauli, the CEO of Meyer Burger, stated with pride. “This success confirms that we meet the requirements of our customers to produce the thinnest wafers with the thinnest wires under optimum process control in the wafer production chain”.
John Andersen jr, the CEO of REC ScanWafer, comments: “We are very pleased with the dedication and commitment from Meyer Burger to further develop sawing technologies for wafer manufacturing. Through this cooperation we expect to make significant advances in our continuous pursuit of more cost efficient manufacturing processes.”
About Meyer Burger Technology Ltd
http://www.meyerburger.ch/
Meyer Burger Technology Ltd is a leading and globally active technology group for innovative systems and processes for cutting and handling crystalline and other high-grade materials.
The machines, competences and technologies of the different companies in the group are used in the solar industry (photovoltaics), semi-conductor and optical industry. The thinnest wafers made from silicon, sapphire or other crystals are required in these three markets to manufacture solar modules, switching circuits or high-performance LEDs. The group’s core competences are made up of a whole range of production processes, machines and systems that are used within the value chain in the manufacture of high quality wafers. The comprehensive range of products is complemented by a worldwide service network with wear and tear parts, consumables, re-grooving service, process know-how, servicing, after-sales service, training and other services. As a globally active company, the group is represented in Europe, Asia and North America in the respective key markets.
Meyer Burger has its headquarters and the production facility of Meyer Burger Ltd in Switzerland, while the group companies, Meyer Burger Automation GmbH, Hennecke Systems GmbH and and AMB Apparate + Maschinenbau GmbH, have their headquarters and production facilities in Germany. The group also has subsidiaries and own service centres in Germany, Norway, China and Japan, which all are represented by its own staff on-site. In Taiwan and the USA, Meyer Burger works with independent sales and service partners that are part of Meyer Burger’s global service network. In other important countries the company relies on selected independent agents. Meyer Burger generated net sales of CHF 455 million in fiscal year 2008 and employed more than 630 staff worldwide as of year end 2008.
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