Meyer Burger has won additional orders for wire saws, cropping saws and wafer inspection systems worth more than CHF 250 million with a customer in Asia. The wire and cropping saws from Meyer Burger Ltd and the inspection systems of Hennecke Systems GmbH will help to secure the manufacturing of high-grade solar wafers. Deliveries are expected throughout 2010 and 2011.
Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) announced today that the group members Meyer Burger Ltd and Hennecke Systems GmbH succeeded in concluding a contract for the supply of high-tech wire saws, cropping saws and wafer inspection systems from a customer in Asia. Deliveries are expected throughout 2010 and 2011. The equipment will help to ensure a best in class solar wafering process. The wire and cropping saws of Meyer Burger Ltd and the wafer inspection systems of Hennecke Systems GmbH will secure the manufacturing of high grade solar wafers.
Peter Pauli, CEO of the Meyer Burger Group, states proudly: “Thanks to the successful implementation of a best in class logistic system and the expansion of capacity, we today have the ability to process orders for key solar companies and maintain our flexibility to the market ”.
Further information:
Werner Buchholz
Head of Corporate Communications
Tel +41 (0) 33 439 05 06
w.buchholz@meyerburger.ch
About Meyer Burger Technology Ltd
www.meyerburger.ch
Meyer Burger is a leading and globally active technology group for innovative systems and processes for
cutting and handling crystalline and other high-grade materials.
The machines, competences and technologies of the different companies within the group are used in the solar industry (photovoltaics), semiconductor and optical industry. The thinnest wafers made from silicon, sapphire or other crystals are required in these three markets to manufacture solar modules, switching circuits or high-performance LEDs. The group’s core competences are made up of a whole range of production processes, machines and systems that are used within the value chain in the manufacture of high quality wafers. Since the merger in January 2010 with 3S Industries Ltd, the worldwide leader in turnkey production lines and single equipment for the manufacturing of solar modules, the group also covers the entire value chain for solar module production and combines the key technologies of soldering, laminating and testing under one roof. Solar module manufacturers worldwide use the string soldering machines of Somont, the laminating lines of 3S Swiss Solar Systems and the testing technologies of Pasan, to produce solar modules whose performance, operating life and quality meet the highest demands. The group’s comprehensive range of products includes a worldwide service network with wear and tear parts, consumables, re-grooving services, process know-how, servicing, after-sales service, training and other services. As a globally active company, the group is represented in Europe, Asia and North America in the respective key markets.
Meyer Burger has its headquarters and the production facility of Meyer Burger Ltd in Switzerland, while the group companies, Meyer Burger Automation GmbH, Hennecke Systems GmbH and AMB Apparate + Maschinenbau GmbH have their headquarters and production facilities in Germany. Diamond Materials Tech, Inc., has its headquarters in Colorado Springs, CO, USA. The production facilities of 3S Swiss Solar Systems and Pasan are also located in Switzerland, while Somont is located in Germany. Meyer Burger Group has also subsidiaries and own service centres in Germany, Norway, Spain, USA, China, Japan, Singapore, South Korea and Taiwan. In other important markets, the company relies on selected independent agents. The registered shares of Meyer Burger Technology Ltd are listed on the SIX Swiss Exchange (Ticker: MBTN).
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Press Release GCL
