Meyer Burger will end the current year with a milestone. MB Wafertec (Meyer Burger Ltd) will manufacture the 1,000th machine at its production facilities in Thun before the end of the year. This is the first time in the history of the company that such a high output of slicing systems is achieved within one year, making this a record.
Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) announced today that MB Wafertec (Meyer Burger Ltd), a member of the Meyer Burger Group, will manufacture the 1,000th machine at its production facilities in Thun before the end of the year. This is the first time in the company’s history that more than 1,000 machines will be manufactured within one year. The 1,000th machine will be manufactured before 23 December 2010. Meyer Burger Group, and MB Wafertec in particular, are benefiting from the positive market development in the solar industry. By end of October, Meyer Burger Group already announced an increase for its net sales guidance for fiscal year 2010, from previously expected CHF 730 million to about CHF 800 million.
Bernhard Gerber, CEO MB Wafertec, says proudly: “Thanks to a high-quality logistics system and on-going capacity adjustments, we were able to meet the sharply rising demand of the market. We owe the implementation of this major success to the enormous commitment and flexibility of our employees”.
Meyer Burger enjoys an excellent order backlog and is looking optimistically towards the year 2011.
Further information
Werner Buchholz
Head of Corporate Communications
T: +41 (0) 33 439 05 06
w.buchholz@meyerburger.ch
About Meyer Burger Technology Ltd
www.meyerburger.com
Meyer Burger is a leading and globally active technology group for innovative systems and processes for cutting and handling crystalline and other high-grade materials.
The machines, competences and technologies of the different companies within the group are used in the solar industry (photovoltaics), semiconductor and optical industry. The thinnest wafers made from silicon, sapphire or other crystals are required in these three markets to manufacture solar modules, switching circuits or high-performance LEDs. The group’s core competences are made up of a whole range of production processes, machines and systems that are used within the value chain in the manufacture of high quality wafers. Since the merger in January 2010 with 3S Industries Ltd, the worldwide leader in turnkey production lines and single equipment for the manufacturing of solar modules, the group also covers the entire value chain for solar module production and combines the key technologies of soldering, laminating and testing under one roof. Solar module manufacturers worldwide use the string soldering machines of Somont, the laminating lines of 3S and the testing technologies of Pasan, to produce solar modules whose performance, operating life and quality meet the highest demands. The group’s comprehensive range of products includes a worldwide service network with wear and tear parts, consumables, re-grooving services, process know-how, servicing, after-sales service, training and other services. As a globally active company, the group is represented in Europe, Asia and North America in the respective key markets.
Meyer Burger has its headquarters and the production facility of MB Wafertec (Meyer Burger Ltd) in Switzerland, while the group companies, Meyer Burger Automation GmbH, Hennecke Systems GmbH and AMB Apparate + Maschinenbau GmbH have their headquarters and production facilities in Germany. Diamond Materials Tech, Inc. has its headquarters in Colorado Springs, CO, USA. The production facilities of 3S Modultec, 3S Photovoltaics and Pasan are also located in Switzerland, while Somont is located in Germany. Meyer Burger Group has also subsidiaries and own service centres in Germany, Norway, Spain, USA, China, Japan, Singapore, South Korea and Taiwan. In other important markets, the company relies on selected independent agents. The registered shares of Meyer Burger Technology Ltd are listed on the SIX Swiss Exchange (Ticker: MBTN).
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