Meyer Burger Technology Ltd strengthens its operating management by establishing the new management position of Chief Operating Officer (COO) and appoints Bernhard Gerber as COO of the Company as of 1 August 2011.
Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) published today, that it will extend its existing Executive Board by establishing a new position of Chief Operating Officer (COO). Bernhard Gerber, currently CEO of MB Wafertec (Meyer Burger Ltd), Thun, will assume the duties and responsibilities of COO of Meyer Burger Technology Ltd and will strengthen the existing management team consisting of Peter Pauli, Michel Hirschi, Dr. Patrick Hofer-Noser and Sylvère Leu. Bernhard Gerber has been acting in various management capacities for Meyer Burger Group since 2007 and, as COO will mainly be responsible for the Global Supply Chain Management, the Global Services and selective process- and integration key projects across the entire group organisation.
On a management level at MB Wafertec, Martin Plüss will take over the responsibilities as CEO of MB Wafertec from Bernhard Gerber as of 1 August 2011. Martin Plüss has been a member of the Executive Board of MB Wafertec in Thun and, as Head of Production & Logistics he has been responsible for Operations since August 2010. He holds a plant and production engineering degree from ETH Zurich and developed a manufacturing facility for Endress+Hauser Flowtec Ltd (manufacturer of flow measuring devices) in Aurangabad, India during 3 years. From 2003-2010, he was Head of Production at Bystronic Laser Ltd, CH-Niederönz (manufacturer of laser cutting equipment).
Portrait Bernhard Gerber:
Bernhard Gerber
Born in 1972, Swiss citizen
Education
Mechanical engineer FH, Industrial engineer FH, Executive MBA
1988 – 1993
Aebi & Co. Ltd, professional education as engine fitter
1996 – 1998
Manager CNC chipping equipment, responsible for purchasing of tools, Project Manager for plant expansion at Bystronic Laser Ltd, CH-Niederönz
1999
Planning of plant expansion at Bystronic Inc., USA-New York
2000
Production planning & scheduling, materials management at
Bystronic Laser Ltd, CH-Niederönz
2001
Assistant of the COO Bystronic Laser Ltd
2003
Head of Assembly Automation and Handling at Bystronic Laser Ltd
2004 – 2005
Manager Laser Machines China at AFM Machinery Ltd (Bystronic Group)
2006 – 2007
Head of Production and Supply Chain Management at
HTT Hauser Tripet Tschudin Ltd, CH-Biel
2007 – 2009
Head of Production at MB Wafertec (Meyer Burger Ltd), CH-Thun
2009
Head of Sales & Marketing at MB Wafertec
2010 – 2011
Chief Executive Officer at MB Wafertec
As of Aug. 2011
Chief Operating Officer and Member of the Executive Board at Meyer Burger Technology Ltd, CH-Baar
For further information please contact:
Werner Buchholz
Head of Corporate Communications
Tel +41 (0) 33 439 05 06
w.buchholz@meyerburger.ch
About Meyer Burger Technology Ltd
www.meyerburger.com
Meyer Burger is one of the world’s leading providers of innovative systems and production lines for photovoltaics in the solar industry, and for the semiconductor and optics industries. Highly efficient wafers made from silicon, sapphire or other crystals are required in these three markets to manufacture solar modules, switching circuits or high-performance LEDs. The group’s core competences encompass a broad range of machines, production processes and systems that are used for the production of high quality wafers, for the inspection and measurement of solar cells, for laminating, soldering and testing of solar modules and for building-integrated solar systems. Meyer Burger Group covers the most important technology steps in the value chain of photovoltaics with its products and solutions portfolio. The Group’s comprehensive range of products includes a worldwide service network with wear and tear parts, consumables, re-grooving services, process know-how, servicing, after-sales service, training and other services. As a globally active company, the Group is represented in Europe, Asia and North America in the respective key markets and has over 1,200 employees as of year-end 2010.
Meyer Burger has its headquarters and the production facility of MB Wafertec (Meyer Burger Ltd) in Switzerland, while the group companies, Meyer Burger Automation GmbH, Hennecke Systems GmbH and AMB Apparate + Maschinenbau GmbH have their headquarters and production facilities in Germany. Diamond Materials Tech, Inc. has its headquarters in Colorado Springs, CO, USA. The production facilities of 3S Modultec, 3S Photovoltaics and Pasan are also located in Switzerland, while Somont is located in Germany. Meyer Burger Group has also subsidiaries and own service centres in Germany, Norway, Spain, USA, China, Japan, Singapore, South Korea, Taiwan and India. In other important markets, the company relies on selected independent agents. The registered shares of Meyer Burger Technology Ltd are listed on SIX Swiss Exchange (Ticker: MBTN).
THIS ANNOUNCEMENT IS NOT BEING ISSUED IN THE UNITED STATES OF AMERICA AND SHOULD NOT BE DISTRIBUTED TO U.S. PERSONS OR PUBLICATIONS WITH A GENERAL CIRCULATION IN THE UNITED STATES. THIS ANNOUNCEMENT DOES NOT CONSTITUTE AN OFFER OR INVITATION TO SUBSCRIBE FOR, EXCHANGE OR PURCHASE ANY SECURITIES. IN ADDITION, THE SECURITIES OF MEYER BURGER TECHNOLOGY LTD HAVE NOT BEEN AND WILL NOT BE REGISTERED UNDER THE UNITED STATES SECURITIES ACT OF 1933, AS AMENDED, OR ANY STATE SECURITIES LAWS AND MAY NOT BE OFFERED, SOLD OR DELIVERED WITHIN THE UNITED STATES OR TO U.S. PERSONS ABSENT REGISTRATION UNDER OR AN APPLICABLE EXEMPTION FROM THE REGISTRATION REQUIREMENTS OF THE UNITED STATES SECURITIES LAWS.
Press Release, PDF, 710KB
